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TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models
(www.tomshardware.com)
this post was submitted on 26 Apr 2025
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I wonder what the end game is now that we are stacking chiplets onto substrates to build processors. Chips with heat pipes and power delivery integrated within the layers?
TSMC is working on channels for liquid cooling build into chips, so we'll probably submerge future ones